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Hotline:

0222.3734.071
HR Department
ext:108
Finance Department
ext:107
Manuf Department
ext: 110
BGA Rework

Reballing service is to remove the damaged solder ball, surplus solder and under-fill from the component and mount new solder balls.


BGA REWORK



 

 

Other types of chips are avaiable for BGA rework:

 

     Ball size(mm): 0.20 ~ 0.50

     Ball pitch(mm): 0.35 ~

     Package size(mm):  3 x 3 ~ 50  x 50

  

POP REWORK 




PACKING


Vacuum Tray Packing